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Breaking Barriers to Advance

Silicon Photonics
800Gb/s 1.6Tb/s and Beyond
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Meet the CARMEL Product Family

CARMEL

  • 400Gb/s DR4 Transmit Photonics IC with integrated laser (TOSA).
  • Used for 400Gb/s and 800Gb/s applications.

CARMEL8

  • 800Gb/s DR8 Transmit Photonics IC with integrated laser.
  • Used for 800Gb/s applications and scalable to 1.6 Tb/s.

Meet the CARMEL Product Family

CARMEL
  • 400Gb/s DR4 Transmit Photonics IC with integrated laser (TOSA).
  • Used for 400Gb/s and 800Gb/s applications.
CARMEL8
  • 800Gb/s DR8 Transmit Photonics IC with integrated laser.
  • Used for 800Gb/s applications and scalable to 1.6 Tb/s.
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DustPhotonics

Low Loss Laser Coupling (L3C) Technology

An innovative solution for integrating off the shelf lasers on the Silicon. Providing advantages in Product Performance, Cost, Power and Scalability.

DustPhotonics provides a comprehensive technology platform for Silicon Photonics, and works with leading supply chain partners to enable high data rates, lower power, lower cost and high-volume scalability.

Our Advantages

DustPhotonics

Higher
Performance

Our efficient laser coupling (L3C) technology with optimized SIP component integration provides lower loss and higher optical margin.
DustPhotonics

Lower
Cost

Our L3C Technology uses simple lasers, reduces the number of lasers in the system thus lowering costs of the Bill Of Materials (BOM) and increasing the yield of the assembled chip.
DustPhotonics

Lower Power
Consumption

The use of fewer lasers and the need for lower current drive reduce the solution power consumption.
DustPhotonics

End-to-end
solution

The DustPhotonics SiP Platform provides a complete technology library: active and passive components, laser integration, and fiber coupling.
DustPhotonics

Standard Supply Chain

Using Tier-1 suppliers for wafer fabrication, components, and Laser integration, enabling you to scale to high volumes as needed.

DustPhotonics

Higher
Performance

Our efficient laser coupling (L3C) technology with optimized SIP component integration provides lower loss and higher optical margin.
DustPhotonics

Lower
Cost

Our L3C Technology uses simple lasers, reduces the number of lasers in the system thus lowering costs of the Bill Of Materials (BOM) and increasing the yield of the assembled chip.
DustPhotonics

Lower Power
Consumption

The use of fewer lasers and the need for lower current drive reduce the solution power consumption.
DustPhotonics

End-to-end
solution

The DustPhotonics SiP Platform provides a complete technology library: active and passive components, laser integration, and fiber coupling.
DustPhotonics

Simplified Supply Chain

Use Tier-1 suppliers for wafer fabrication, components, and Laser integration, enabling you to scale to high volumes as needed.

Our Technology

DustPhotonics

Lasers Integration

Low Loss Laser Coupling (L3C) Technology – an innovative solution for integrating off the shelf lasers on the Silicon.

DustPhotonics

Active Elements

DustPhotonics provides high-speed modulators and detectors which supports a broad range of wavelengths and high data rates.

DustPhotonics

Passive Elements

DustPhotonics offers the optical structures to build your product. This includes Optical waveguides, splitters, combiners and components for WDM designs.

DustPhotonics

Comprehensive Approach

Our proven building blocks for modular integration providing high performance in a scalable solution for the communication optical market.

DustPhotonics’ Silicon Photonics Product

Carmel

Deploy multiple chipsets using a direct drive from the DSP or with an external driver for unrivaled speed and performance.

News

Immersion Cooling in Silicon Photonics

Silicon Photonics and the Future of Generative AI
ECOC 2023 Wrap-up Including New Announcement from DustPhotonics -hp
Dustphotonics Debuts Industry’s First 800G Silicon Photonics Chip at ECOC 2023
Industry-First Merchant 800G Silicon Photonics Chip for Hyperscale Data Centers and AI Applications
Industry-First Merchant 800G Silicon Photonics Chip for Hyperscale Data Centers and AI Applications

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DustPhotonics

Ronnen Lovinger

CEO & Board Member

Python Automation Engineer­

Modiin, Israel







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