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Breaking Barriers to Advance

Silicon Photonics
800Gb/s 1.6Tb/s and Beyond
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Meet the CARMEL Product Family

CARMEL

  • 400Gb/s DR4 Transmit Photonics IC with integrated laser (TOSA).
  • Used for 400Gb/s and 800Gb/s applications.

CARMEL8

  • 800Gb/s DR8 Transmit Photonics IC with integrated laser.
  • Used for 800Gb/s applications and scalable to 1.6 Tb/s.

Meet the CARMEL Product Family

CARMEL
  • 400Gb/s DR4 Transmit Photonics IC with integrated laser (TOSA).
  • Used for 400Gb/s and 800Gb/s applications.
CARMEL8
  • 800Gb/s DR8 Transmit Photonics IC with integrated laser.
  • Used for 800Gb/s applications and scalable to 1.6 Tb/s.

Low Loss Laser Coupling (L3C) Technology

An innovative solution for integrating off the shelf lasers on the Silicon. Providing advantages in Product Performance, Cost, Power and Scalability.

DustPhotonics provides a comprehensive technology platform for Silicon Photonics, and works with leading supply chain partners to enable high data rates, lower power, lower cost and high-volume scalability.

Our Advantages

Higher
Performance

Our efficient laser coupling (L3C) technology with optimized SIP component integration provides lower loss and higher optical margin.

Lower
Cost

Our L3C Technology uses simple lasers, reduces the number of lasers in the system thus lowering costs of the Bill Of Materials (BOM) and increasing the yield of the assembled chip.

Lower Power
Consumption

The use of fewer lasers and the need for lower current drive reduce the solution power consumption.

End-to-end
solution

The DustPhotonics SiP Platform provides a complete technology library: active and passive components, laser integration, and fiber coupling.

Standard Supply Chain

Using Tier-1 suppliers for wafer fabrication, components, and Laser integration, enabling you to scale to high volumes as needed.

Higher
Performance

Our efficient laser coupling (L3C) technology with optimized SIP component integration provides lower loss and higher optical margin.

Lower
Cost

Our L3C Technology uses simple lasers, reduces the number of lasers in the system thus lowering costs of the Bill Of Materials (BOM) and increasing the yield of the assembled chip.

Lower Power
Consumption

The use of fewer lasers and the need for lower current drive reduce the solution power consumption.

End-to-end
solution

The DustPhotonics SiP Platform provides a complete technology library: active and passive components, laser integration, and fiber coupling.

Simplified Supply Chain

Use Tier-1 suppliers for wafer fabrication, components, and Laser integration, enabling you to scale to high volumes as needed.

Our Technology

Lasers Integration

Low Loss Laser Coupling (L3C) Technology – an innovative solution for integrating off the shelf lasers on the Silicon.

Active Elements

DustPhotonics provides high-speed modulators and detectors which supports a broad range of wavelengths and high data rates.

Passive Elements

DustPhotonics offers the optical structures to build your product. This includes Optical waveguides, splitters, combiners and components for WDM designs.

Comprehensive Approach

Our proven building blocks for modular integration providing high performance in a scalable solution for the communication optical market.

DustPhotonics’ Silicon Photonics Product

Carmel

Deploy multiple chipsets using a direct drive from the DSP or with an external driver for unrivaled speed and performance.
  • 400Gb/s DR4 Transmit Photonics IC with integrated laser (TOSA).
  • Used for 400Gb/s and 800Gb/s applications.
  • Deployed with multiple chipsets, using Direct Drive from the DSP or with an external driver.
Samples available now!

News

Dustphotonics Debuts Industry’s First 800G Silicon Photonics Chip at ECOC 2023
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Industry-First Merchant 800G Silicon Photonics Chip for Hyperscale Data Centers and AI Applications
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DustPhotonics will be at ECOC in October 2023
Read more
DustPhotonics and MaxLinear Announce New Level of Silicon Photonics Integrated Solution Based on Keystone 5nm DSP
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Ronnen Lovinger

CEO & Board Member

Python Automation Engineer­

Modiin, Israel







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