
Meet the CARMEL Product Family
CARMEL
- 400Gb/s DR4 Transmit Photonics IC with integrated laser (TOSA).
- Used for 400Gb/s and 800Gb/s applications.
CARMEL8
- 800Gb/s DR8 Transmit Photonics IC with integrated laser.
- Used for 800Gb/s applications and scalable to 1.6 Tb/s.
Meet the CARMEL Product Family
- 400Gb/s DR4 Transmit Photonics IC with integrated laser (TOSA).
- Used for 400Gb/s and 800Gb/s applications.
- 800Gb/s DR8 Transmit Photonics IC with integrated laser.
- Used for 800Gb/s applications and scalable to 1.6 Tb/s.


Low Loss Laser Coupling (L3C) Technology
An innovative solution for integrating off the shelf lasers on the Silicon. Providing advantages in Product Performance, Cost, Power and Scalability.
DustPhotonics provides a comprehensive technology platform for Silicon Photonics, and works with leading supply chain partners to enable high data rates, lower power, lower cost and high-volume scalability.
Our Advantages
Higher
Performance
Lower
Cost
Lower Power
Consumption
End-to-end
solution
Standard Supply Chain
Using Tier-1 suppliers for wafer fabrication, components, and Laser integration, enabling you to scale to high volumes as needed.
Higher
Performance
Lower
Cost
Lower Power
Consumption
End-to-end
solution
Simplified Supply Chain
Use Tier-1 suppliers for wafer fabrication, components, and Laser integration, enabling you to scale to high volumes as needed.
Our Technology
Lasers Integration
Low Loss Laser Coupling (L3C) Technology – an innovative solution for integrating off the shelf lasers on the Silicon.
Active Elements
DustPhotonics provides high-speed modulators and detectors which supports a broad range of wavelengths and high data rates.
Passive Elements
DustPhotonics offers the optical structures to build your product. This includes Optical waveguides, splitters, combiners and components for WDM designs.
Comprehensive Approach
DustPhotonics’ Silicon Photonics Product
Carmel
- 400Gb/s DR4 Transmit Photonics IC with integrated laser (TOSA).
- Used for 400Gb/s and 800Gb/s applications.
- Deployed with multiple chipsets, using Direct Drive from the DSP or with an external driver.
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